Hefei Hengli to Showcase at the 2026 Munich Shanghai Electronica, Empowering the Upgrade of Electronic Intelligent Manufacturing with Full Stack Thermal and Surface Treatment Equipment

On July 1-3, 2026, Hengli Eletek Co., Ltd.(hereinafter referred to as "Hefei Hengli") made its debut at the 2026 Munich Shanghai Electronics Show (electronica China 2026), with booth number N1 Hall 153. As a core service provider of intelligent equipment in the electronic components industry, Hefei Hengli closely adheres to the era demand of electronic component manufacturing evolving towards high precision, high reliability, and intelligence. It focuses on showcasing the full chain equipment matrix covering key links such as firing, coating, cleaning, and environmental protection of electronic components and related materials such as MLCC, inductors, and sensors. With its hardcore technology strength, it showcases the innovative vitality of Chinese electronic equipment manufacturing enterprises to global customers.

Deeply cultivate the core process of MLCC manufacturing, break through the bottleneck of high-end component technology

Multi layer ceramic capacitors (MLCC), as the "industrial rice" of the electronics industry, have strict requirements for the temperature field uniformity, atmosphere control accuracy, and glue discharge efficiency of the firing equipment in their manufacturing. Hefei Hengli has showcased a full stack thermal equipment product line covering the core processes of MLCC, focusing on areas such as glue dispensing, fast firing, secondary sintering, and end electrode bonding.

(Atmosphere burning end furnace, roller fast burning furnace, secondary false burning furnace)

Full range of inductor sintering solutions, empowering high-quality manufacturing of magnetic devices

With the increasingly widespread application of magnetic devices such as integrated inductors in fields such as automotive electronics and communication base stations, the miniaturization and high reliability of these devices have raised higher requirements for sintering processes. The integrated inductor sintering equipment exhibited by Hefei Hengli provides efficient and stable equipment support for the sintering and heat treatment of magnetic devices, relying on the company's more than 30 years of technical accumulation in the field of thermal engineering.

(Vacuum curing furnace, atmosphere co firing furnace, hot air glue removal furnace)

PVD magnetron sputtering equipment breakthrough, helping high-end localization of thin film devices

Physical vapor deposition (PVD) magnetron sputtering technology is a key process for achieving high-precision and high uniformity coating in the thin film preparation process of ceramic substrates, electronic ceramic devices, and other fields. During this exhibition, PVD magnetron sputtering equipment attracted the attention of many representatives from electronic component manufacturing companies due to its technological advantages in film uniformity, adhesion, and process stability.

(Ceramic substrate PVD equipment, component PVD equipment)

Precision surface treatment equipment matrix, centrifugal plating and cleaning equipment leading the new benchmark of micro element electroplating

In the surface treatment of electronic components, precision electroplating and cleaning processes directly determine the reliability and yield of the product. Hefei Hengli exhibited its independently developed centrifugal plating equipment and precision cleaning equipment, forming a complete surface treatment equipment matrix from electroplating to cleaning.

(Closed electroplating equipment, centrifugal plating equipment, gas phase cleaning equipment)

The Hefei Hengli exhibition team relied on their rich industry experience to provide systematic and detailed product introductions to visiting customers through equipment model demonstrations, 3D structure analysis, and technical explanations. This appearance at electronica China 2026 further solidifies the company's industry position in the global electronic device manufacturing field and makes it one of the highly anticipated equipment exhibitors at this exhibition. Hefei Hengli will continue to increase research and development investment, deepen international technology cooperation and market layout, and use innovative equipment to help the electronic components industry develop towards high-end, intelligent, and green directions with high quality.