Products

:
Electronic Components
  • Product details:  Application: for drying of water and organic solvents, high temperature firing, brazing, sealing, annealing for SMT, chip bonding, metal packaging and the production of DBC, MLCC, varistors, capacito...
  • Product details:  Product Description: belt furnace and bell type ovenApplication:For pre-firing, firing and co-firing of microwave ferrite, magnetic materials, advanced ceramics, electronic components, powder metallu...
  • Product details:  Application: For drying of welding semiconductor and precision components in N2 atmosphere, binder burn out in the fabrication of ceramic products, curing of organic materials, and specialty drying p...
  • Product details:   Application: For high temperature firing and heat treatment of products such as Hybrid IC, Chip-R, electronic components electrode, LTCC and stainless steel heater.Feature: FEC ceramic fiber heater,...
  • Product details:  Application:Sealing, metalizing, brazing, oxidizing, and annealing in controlled atmosphere for chip bonding, electronic packaging (metal to metal, metal to glass and metal to ceramic), AlSiC, VFD, P...
firstprevious12nextlast

Contact Us

NO.19 Hehuan Road, New&High Tech Development Zone, Hefei, Anhui, China 230088
Tel:0551-65846903 
Fax:0551-65846907     
E-mail: Hello@furnaceschina.com; Hli43@ecmee.com

Follow us