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Product details
  • Name: Electronic Component Barrel Plating Automatic Line
  • Number: 018
  • Added time: 2014-07-28
  • Views : 113

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ApplicationThe mass plating production of chip component and micro metal parts;Pretreatment, silver plating, nickel plating and tin plating of chip components.

Project experiencesElectroplating production line for SMD and connectors etc.

Feature:The roller is optimal designed of technology according customers requirements.   Having reliable system, high efficiency, bright fine and uniform appearance. The line takes man-machine interface touch-screen control management. It can effectively monitor the data, PH, time and running conditions etc,and is easy to adjust process parameter according to different process feature.

Technical Specification: Cantilevered crane, the running rate of crane: 0-25 m/min, lifting rate of crane: 0-12 m/min, the lifting weight: 50-100 kg.

Option: Special roller, solution online testing and automatic feeding, roller with speed regulator, computer control system, and rectifier automatic control.

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NO.19 Hehuan Road, New&High Tech Development Zone, Hefei, Anhui, China 230088

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