Single Cylinder Centrifugal Plating
Mainly used for depositing gold, silver, copper, nickel and tin layers on metal and ceramic micro-devices, as well as nickel/tin layers on chip components (MLCCs, chip resistors, chip inductors, silicon carbide, etc.)
Options:
Passive components, MLCC, energy saving & environmental protection, precision electroplating
Product Feature
1. Fully automatic operation ensures safe, stable and reliable equipment performance;
2. Electroplating process parameters can be flexibly adjusted according to products;
3. No need for auxiliary plating materials or sorting sections, improving production efficiency and reducing operating costs;
4. Small space occupation and short operation time.
Product Details
Application industry: passive components, metal/ceramic packaged casings, micro-device manufacturing;
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