Mainly used for depositing gold, silver, copper, nickel and tin layers on metal and ceramic micro-devices, as well as nickel/tin layers on chip components (MLCCs, chip resistors, chip inductors, silicon carbide, etc.)
1. Adopts independent multi-cylinder design, allowing each cylinder to set process parameters and operate independently without interference;
2. Fully automatic operation ensures safe, stable and reliable equipment performance;
3. Electroplating process parameters can be flexibly adjusted according to products.
4. Multiple cylinders share a plating mother tank equipped with an electrolysis device for online electrolysis;
5. Equipped with an automatic discharging function to solve problems such as complex vacuum discharging, solution mixing and low discharging efficiency;
6. No need for auxiliary plating materials or sorting sections, improving production efficiency and reducing operating costs;
7. Small space occupation and short operation time.
Application industry: passive components, metal/ceramic packaged casings, micro-device manufacturing;
