Mainly used for fully automatic electroplating, surface treatment and other wet chemical surface treatment production of electronic components, semiconductors, aerospace electronics, optical devices, etc.
1. Customized design based on user process, adoptable of linear, L-shaped and U-shaped structural layouts;
2. Controlled by PLC and HMI control system, capable of fully automatic continuous production, semi-automatic intermittent production and full manual operation;
3. Not only meets the needs of conventional electroplating lines, but also realizes flexible electroplating and data traceability. Safety interlock protection functions between equipment avoid potential safety hazards caused by human operation errors or equipment failures;
4. Optionally equipped with an enclosed chamber structure. The top of enclosed chamber is equipped with a central exhaust system to centrally collect and discharge exhaust gases escaping from the upper part of working area, preventing exhaust gases from condensing and dripping to contaminate the bath solution;
5. Features uniform appearance, elegant design, and is convenient for maintenance and on-site management.