1. Modular design: each process unit adopts relatively independent standardization for easy maintenance;

2. High integration: adopts a highly integrated design concept, with compact structure and small footprint;

3. High intelligence: enables fully automatic control, reduces human intervention, ensuring process consistency and stability;

4. Process-oriented customization: customized design based on users actual processes, ensuring all design concepts are centered on process adaptation;

5. Green & Environment-friendly: Incorporates advanced domestic and international energy saving and emission reduction designs to maximize "green" electroplating;

6. Advanced technology: integrates high level domestic and international technologies, processes, materials and supporting devices. Equipped with digital management functions, including data storage and reserved remote communication interfaces.

Application industry: metal/ceramic packaged tube shells, passive components, military weapon equipment, aerospace electronics, automotive parts, new energy, semiconductor devices, electronic components, optical devices, HTCC, DPC and other fields;

Application processes: electroplating of precious metals such as gold, silver, copper, nickel and tin, electroless plating, oxidation, phosphating, passivation, pickling, polishing and other processes.