Mainly used for electroplating and electroforming processes requiring high coating uniformity and quality.
1. Modular design, highly integrated system, flexible and multi-purpose platform
2. Diverse rotation modes: Orbital revolution, Orbital revolution+ rotation (adjustable speed and direction)
3. Multiple transmission methods: upper transmission, lower transmission
4. Significantly improves uniformity of electric field, temperature field, and concentration field, enhancing plating quality and uniformity with COV value 5-10 times better than traditional rack plating
Application industries: metal/ceramic packaged tube shells, military weapon equipment, aerospace electronics, automotive parts, new energy, semiconductor devices, electronic components, optical devices, HTCC, DPC and other fields;
Application processes: electroplating and electroless plating of precious metals such as gold, silver, copper, nickel and tin.
