Mainly used for drying before thick-film package housings encapsulation, as well as drying and firing processes for materials like silicon wafers, gallium arsenide and glass in semiconductor manufacturing.
Multi-layer independent temperature control for a uniform temperature field; the furnace chamber adopts a visualizable structure;
Equipped with a stainless steel heater and aluminum heating plate, the temperature measurement and control system uses dual-core platinum resistors, one for temperature control and the other for measurement, to ensure uniform surface temperature;
Touch screen +PLC centralized control enables programmable settings for vacuum pumping and protective gas filling in arbitrary sequence cycles, as well as programmable control of heating and vacuum curves.
| Series | Effective Volume | Chamber | Working Vacuum | Vacuum Pump | Max Temp | Atmosphere |
| HXV | 90-350L | Single/Multiple | ≤10pa | Dry/Oil | 300℃ | Air/N2/Vacuum |
