Fully mirror stainless steel chamber with unique hot air circulation effectively ensures atmosphere uniformity, applied to aging of electronic components and drying & curing of semiconductor components.
Widely used for drying and debinding processes of electronic components, instruments, plastics and other products or materials under constant temperature environments. The chamber is sealed by welding mirror stainless steel, with internal cleanliness reaching Class 100. Featuring forced hot air circulation design and intelligent PID temperature control system for excellent temperature control accuracy, the chamber is available in single-chamber or multi-chamber configurations.
Series | Effective Volume | Cleanliness | Integration Efficiency | Max Temp | Heating Zone | Atmosphere |
HXV | 75-320L | Class 100 | 99.99% | 300℃ | Single | Air/N2 |