HTCC高温气氛箱式烧结炉
HTCC High Temperature Box Oven

Designed for debinding-firing processes of ceramic materials such as electrostatic chucks, HTCC substrates, package housings and SMD components under N₂+H₂ (dry/wet) atmospheres, as well as new product process experiments.

Options:
Electrostatic chuck, HTCC substrate, HTCC package housing, SMD, high temperature, multiple atmospheres, dew point meter, humidification
Product Feature

1. Atmosphere, temperature and dew point are controllable with dry/wet gas path switching, composed of a gas control rack, humidification chamber and insulated gas inlet pipes. The exhaust port is equipped with a resin/oil recovery device and exhaust gas treatment unit.

2. Each gas inlet line adopts a "one active, one standby" configuration to effectively ensure continuous atmosphere supply.

3. The humidification chamber is divided into pre-firing, main-firing and pre-moistening units. An imported dew point meter enables precise control of each inlet's dew point with an accuracy of ±1℃.

4. The chamber uses herringbone-patterned dense corundum-mullite material. Molybdenum wires are suspended around the chamber for precise temperature control.

Product Details
Series Chamber Volume Max Temp Oxygen Content Pessure Measurement Heating Element Atmosphere
HXL 250L 1700℃ 10ppm Oven pressure feedback Molybdenum wire H2+N2 (Adjustable ratio of dry & wet gas mixture)
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