Mainly used for debinding-firing of MLCC/LTCC/HTCC/aluminum nitride substrates in electronic components, as well as drying, curing, debinding, tempering, annealing, aging, preheating and vitrification of ceramic powders, substrates, magnetic materials, glass powders and 3D printed parts.
Process for MLCC/LTCC/HTCC/aluminium nitride substrate etc. to slowly evaporate Binder at low temperature; also suitable for debinding of metal materials and optoelectronic devices; Equipped with high-efficiency hot air circulation heater, imported temperature control modules, large LCD display, automatic oven pressure control and configurable atmosphere combinations (N₂, N₂+H₂, humidified gas); Supports process programming, storage and real-time monitoring.
| Series | Chamber Volume | Max Temp | Oxygen Content | Pessure Measurement | Cleanliness | Atmosphere |
| HXF | 125-1600L | 800℃ | 10ppm | Oven pressure feedback | Class 100 | Air/N2/O2/H2/Ar |
