Hot Air Reflow Oven
Circulating hot air heating for reflow soldering in micro-assembly processes of surface mount components, modules, chips and power devices.
Options:
Industrial computer, touch screen, digital flow switch, temperature profile recorder
Product Feature
Utilizes circulating hot air heating for thorough and efficient soldering, meeting current SMT high-density welding requirements. Features uniform temperature, complete debinding and convenient operation.
Product Details
| Series | Belt Width | Chamber Height | Max Temp | Zone Length | Heating Zone | Atmosphere |
| HSF | 300/420/560mm | 60mm | 400℃ | 355/600mm | 3-12 | N2/Air |
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0551-65846903
