Pressure-assisted firing of nano silver materials in a vacuum atmosphere, where fusion between nano-silver particles occurs through high temperature heating and pressurisation under vacuum conditions to form a dense sintered body. Compared with soft brazing, silver firing technology enhances thermal conductivity by 3 times, electrical conductivity by 5 times, and module service life by 5-10 times, making it a core process for third-generation semiconductor packaging.
Integrates a multi-field coupling control system for force-thermal-gas parameters, breaking through three core technologies: pressure uniformity, temperature uniformity and atmosphere control (adjustable low-oxygen/vacuum/nitrogen modes). Using gas-liquid composite drive and modular quick-change design, it achieves high-reliability firing with silver layer porosity <5% and thermal conductivity 240 W/(m·K), supporting 98.5% yield for SiC power modules. Widely applied in high-voltage and high-power fields such as new energy vehicles and photovoltaic inverters.
| Series | Pressure Head Number | Max Firing Pressure | Max Temp | Adaptive Indenter Height | Platen Stroke | Atmosphere |
| HSP-M/P | 3-24 | 40MPa | 400℃ | ≥10mm | ≥190mm | N2/Air |
