Achieves high quality and efficient firing in the fields of chips, copper substrates, high-speed rail brake pads, electronic ceramics, new energy materials and aerospace alloys by means of thermal-pressure collaboration, continuous production and multi-environment adaptation.
Designed for brazing of copper substrates and firing of various ceramic materials (oxide ceramics, nano ceramics, composites, semiconductor ceramics and semiconductor chips) via thermal-pressure co-firing and continuous production. Key features include:
1. Adjustable working temperature range: 500–1000℃
2. Height detection device on the pressing mechanism
3. Carrier plate anti-deviation and tilting detection systems in the conveying system
4. Hydraulic pressing mechanism in heating zone with adjustable pressure: 5-30 tons
| Series | Pusher Size | Effective Height | Max Temp | Zone Length | Heating Zone | Atmosphere |
| HTD/HTL | 400-500mm | 50-400mm | 1200℃ | 500mm/750mm | 3-16 | Air/N2/H2/Ar |
