HTCC High Temperature Atmosphere Pusher Kiln
Mainly used for debinding-firing processes of alumina substrates, HTCC, SMD components and electrostatic chucks under N₂+H₂ (dry/wet) atmospheres.
Options:
Industrial computer, touch screen, oxygen analyzer, HTCC substrate, HTCC shell, SMD, high temperature, multiple atmospheres, dew point, humidity, single/double pusher
Product Feature
Improved from traditional high temperature pusher kilns, it features an innovative framework for precise atmosphere control, modular expansion, material-process collaboration, and intelligent energy efficiency optimization, achieving breakthroughs in process boundary extension, full life cycle cost reduction and cross-field process integration.
Product Details
| Series | Pusher Size | Effective Height | Max Temp | Zone Length | Heating Zone | Atmosphere |
| HTD/HTL | 200-280mm | 50-260mm | 1700℃ | 590-870mm | 10-20 | H2+N2 (Adjustable ratio of dry & wet gas mixture) |
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